Installation of electronic modules

PRINTED CIRCUIT BOARD SURFACE MOUNTING LINE

The surface mounting line is a high-performance PCB assembly site in serial and large-scale production.

High productivity: 30,000 components per hour; installation accuracy: 25 microns; the capability to install components: from 0.4 mm to 75 mm; full compliance with all modern trends for electronic production.

For small-scale assembly of prototypes, Zaslon JSC is equipped with another high-tech section: an automatic dispenser, a surface-mounting machine and a vapor-phase furnace.

The equipment allows performing the assembly of any level of complexity, including the assembly of boards not designed for mass production, with neither margins, nor reference marks, nor stencil.

THE EQUIPMENT ALLOWS PERFORMING THE ASSEMBLY OF ANY LEVEL OF COMPLEXITY, INCLUDING THE ASSEMBLY OF BOARDS NOT DESIGNED FOR MASS PRODUCTION, WITH NEITHER MARGINS, NOR REFERENCE MARKS, NOR STENCIL.

The control system allows excluding possible defects and displacements during assembly at the surface mounting site.

Samsung SM482 Component Installation Machine

TECHNICAL SPECIFICATIONS:

DESCRIPTION:

The Samsung SM482 Component Installation Machine is designed for surface mounting of components using SMT (Surface Mount Technology) technology. Surface mounting is the most common method of designing and assembling electronic components on printed circuit boards today. Samsung SM482 can perform high-speed component installation. High accuracy of the machine and presence of centering cameras make it possible to recognize and install components with pitch even up to 0.3 mm. The centering cameras are located on the installation module in such a way that the components are recognized “In-Flight”.

SPECIFIC FEATURES:

• the Polygon Component Recognition System allows describing and entering the contours of any non-standard component into the database in a matter of seconds
• the automatic calibration system ensures high repeatability of the assembly
• the In-Flight Centering System with high-resolution cameras
• the backlight fine-tune option makes it possible to recognize even such complex components as BGA, QFP, small-pitch connectors, etc.

NC25eco Automatic Circuit Board Washing System

TECHNICAL SPECIFICATIONS:

DESCRIPTION:

The automatic system is designed for high-quality jet washing of printed components, stencils and squeegees from flux residues after soldering and other types of contamination to occur in the process of producing and installing printed circuit boards.

SPECIFIC FEATURES:

• fast fixation of printed circuit boards in the snap-in
• option of additional loading of printed circuit boards during the washing cycle
• automatic transportation of printed circuit boards
• continuous monitoring specific electrical conductivity in the rinsing area
• quick drying in the aluminum vacuum chamber

Automatic system of cleaning stencils, washing boards and printed circuit boards PBT Super Swash III

TECHNICAL SPECIFICATIONS:

DESCRIPTION:

The automatic jet washing system is designed for high-quality washing of printed components, stencils, squeegees from flux residues after soldering and other types of contamination to occur in the process of producing and installing printed circuit boards.

SPECIFIC FEATURES:

• location of the nozzles: no shadow zones, and high-pressure washing solution provide unsurpassed efficiency of washing boards and cleaning stencils
• internal lighting helps to visually assess the quality of washing
• due to the high efficiency of washing and drying, which are carried out by using air knives feeding heated compressed air, the cycle time, even for the most complex boards, as a rule, does not exceed 40 minutes, and on average is 20–30 minutes
• continuous monitoring specific electrical conductivity of the washing liquid in the rinsing area
• fast fixation of printed circuit boards

High-performance Asymtek Axiom X-1010 Automatic Dosing Device

TECHNICAL SPECIFICATIONS:

DESCRIPTION:

The Axiom X-1010 machine is designed for applying soldering paste to a printed circuit board in conditions of small-scale multiproduct production. The machine is capable of solving a wide range of paste application tasks, making the dosing process particularly flexible.

SPECIFIC FEATURES:

• applying soldering paste with no stencil
• option of making a prototype of the board, billet, product
• option of dosing both on empty PCB and on already assembled printing units
• application of the paste under boards of complex design: if the design features of the printing unit imply the presence of bumpers or other elements to interfere with traditional methods of application, Axiom X-1010 will easily cope with the application
• high accuracy and repeatability of application
• the automatic dosing system allows applying the paste to boards requiring completion at the final stages or repairing technologically complex boards

Viscom S3088 flex Automatic Optical Inspection System

TECHNICAL SPECIFICATIONS:

DESCRIPTION:

The AOI S3088 flex system is designed for reliable, efficient detection of defects and rapid debugging of the technological process. The AOI system is equipped with a number of digital video cameras and the data processing unit responsible for recognizing defects. The mode of 3D shooting of the inspected product allows making its analysis better and more detailed.

SPECIFIC FEATURES:

• detection of all types of defects
• high inspection speed

DETECTED DEFECTS:

• lack of components
• displacement of components
• polarity
• short circuit
• solder joint quality

Asscon VP6000 Vacuum Vapor-Phase Soldering System

TECHNICAL SPECIFICATIONS:

DESCRIPTION:

Soldering in the vapor-phase medium improves the quality of soldering, and the presence of a vacuum chamber in the furnace reduces the number of voids in the solder joint by 95 %. Vapor-phase soldering makes it possible to solder products of any complexity: from flexible printed circuit boards to complex multilayer boards, including those on the aluminum base. The heating process does not depend on the shape, color, mass and mass distribution of the product. Soldering takes place without oxygen access and without the use of inert gas, which also has a positive effect on the final result, and allows manufacturing even Class 3 products in accordance with international standards IPC.

SPECIFIC FEATURES:

• no overheating of components
• provides high-quality solder joints
• soldering takes place in the inert environment without oxygen access
• adjustable vacuum level allows getting high-quality solder joints without voids
• simple switching on/off of the vacuum function ensures maximum flexibility of operation

REHM VXS air 2450 Convection Soldering System

TECHNICAL SPECIFICATIONS:

DESCRIPTION:

Vision XS Convection Reflow System for medium and large batches. Advantages of the conveyor convection system are its productivity, as well as the less number of defects associated with surface tension (“tombstone” defect and tightening of elements).

SPECIFIC FEATURES:

• all heating areas are thermally separated and individually regulated, resulting in stable solder reflow
• the special design of the “plate with nozzles” and the separately adjustable flow rate in the upper and lower heating areas ensure uniform heat supply throughout the process area and, thus, complete and even heating of materials, due to which tension in the board and soldering defects are minimized

Micromex DXR X-Ray Inspection System

TECHNICAL SPECIFICATIONS:

DESCRIPTION:

The system is designed for non-destructive X-ray inspection with high resolution in real time, as well as for automated X-ray inspection. The system has a precision manipulator, a 180 kV X-ray tube, a thermally stabilized detector, which allows using these installations for the ranges of 2D and 3D inspection tasks. The software allows completely detecting defects. The use of the high-contrast DXR250RT digital detector with active cooling makes it possible to obtain high-quality 2D X-ray images.

SPECIFIC FEATURES:

• microchip crystal defect analysis
• soldering quality control
• detection of cracks in conductors with their size of <1 microns
• automated inspection of printed circuit boards, microchips, BGA components, adapter holes

DEK HORIZON 03iX Screen Printer

TECHNICAL SPECIFICATIONS:

DESCRIPTION:

The screen printing technology used in the Horizon 03iX printer is based on the principle of fast, but high-quality assembly of boards. The accuracy of repeatability of combining the stencil with the board is due to the system of precise optical alignment. Quality of the alignment and the stencil manufacturing technology joint make it possible to produce boards even with BGA in serial and large-scale production modes without loss of quality.

SPECIFIC FEATURES:

• universal stencil holder
• high accuracy and repeatability of the process
• print cycle time: 12 s